VIASYSTEMS II LIMITED

Each obligor company covenants to pay to the chargee all monies obligations and liabilities due, owing or incurred by it to the finance parties (as defined) or any of them under or pursuant to the finance documents (as defined) and in accordance with the terms of the deed

The unpaid principal of and interest on the chips loans (as defined) and all other obligations and liabilities of the chargor (as defined) or chips limited (as defined), as the case may be, to the english agent (as defined) or to the english lenders (as defined), whether direct or indirect, absolute or contingent, due or to become due, or now existing hereafter incurred, which may arise under, out of, or in connection with the finance documents (as defined), whether on account of principal, interest, reimbursement obligations, fees, indemnities, costs, expenses or otherwise,

The unpaid principal of and interest on the chips loans (as defined) made to the company and all other obligations and liabilities due or to become due from the company to the chargee (the "english agent") as agent and trustee for itself and each of the english lenders (as defined) or to the english lenders under,out of or in connection with the facility documents (as defined)